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Semiconductor Packaging Engineer

Company: TRUMPF
Location: Cranbury
Posted on: March 20, 2023

Job Description:

How brave are you? We are a high-tech company providing machine tools and laser technology, and are looking for people who can face new challenges with a fresh mind. As an independent family company, we offer you the freedom and trust to put your brave ideas into practice. With you on board, we would like to power ahead with the digital networking of the manufacturing industry. Our passion and creative drive ensure that we are an innovative force - across the globe at over 70 TRUMPF locations. SummaryTRUMPF Photonics is a high-tech company leading the development and manufacturing of high-power semiconductor laser diodes, high-power laser diode-based products and optical components, located in Cranbury, NJ. Our laser diode products are at the heart of innovative laser systems that enable leading-edge manufacturing technologies for a wide variety of products, from semiconductor chips and cell phones to electric cars and space vehicles. We are looking for people who are facing new challenges with a fresh mind and strive to contribute to creating great technologies for the products of the future. In return we offer a competitive salary, a generous benefits package including medical, vision, dental, 401K plans and parental leave, as well as opportunities to advance your skills and your career. The Semiconductor Packaging Engineer will be responsible for the mounting, bonding, and interface characterization of diode laser devices. Engineer will be responsible for complete ownership of the production equipment and process control/sustaining. Principle Duties & ResponsibilitiesThe statements below are intended to describe the general nature and level of work in this position. They are not intended to be an exhaustive list of all responsibilities. The position may require that employees perform other duties as assigned.Semiconductor Packaging Engineer Principal Duties & Responsibilities

  • Ownership of semiconductor die bonding and wire bonding processes and tools for high powered diode lasers.
  • Leads yield improvement, cost reduction projects and 4D/8Ds.
  • Responsible for improving tool uptime of die bonding and wire bond machines.
  • Consistently leads complex troubleshooting of semiconductor assembly equipment and process issues.
  • Characterization of existing and new laser diode packaging processes based on optical parameters and critical placement accuracy.Semiconductor Packaging Engineer Requirements/Education
    • B.S. or M.S. in Mechanical/Electrical Engineering, Material Science, or Physics
    • 3+ years hands on experience die bonding (die attach/flip chip), thermocompression bonding, wire bonding, vacuum reflow, and pick and place systems
    • Prior experience in an engineering support role for manufacturing of laser or semiconductor products is desired.
    • Experience with Statistical process control (SPC)All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, citizenship, disability or protected veteran status. #MST

Keywords: TRUMPF, Trenton , Semiconductor Packaging Engineer, Engineering , Cranbury, New Jersey

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